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Ding Sheng Electronics Ltd.
Ding Sheng Electronics Ltd.  

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SiRF V GPS/GNSS Module GPS Engine Board 

Payment Terms: T/T,Paypal 
Place of Origin: Taiwan 
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Product Detail

Model No.: LR9150
Production Capacity: 1000~3000pcs/week
Delivery Date: 3-4 weeks
Means of Transport: Air,Air
Packing: 1000pcs/reel
Dimension: 24x20x2.9mm

• SiRF V GPS/GNSS MODULE
• Dimensions: 24 x 20 x 2.9 mm

The LR9150 utilized SiRFstarV™ and features Quad-GNSS for tracking GPS, GLONASS, BDS and Galileo satellites. The product family delivers space accurate continuous location, advanced power management and high interference immunity. These continue to push the envelope of performance in sensitivity, TTFF and urban canyon availability and accuracy. With a built-in DSP and extremely low power consumption, the family can get fast location fixes for geo-tagging images or videos, asset tracking and wearable applications.


Performance

 • GPS, GLONASS, Galileo and SBAS reception for high GNSS availability and accuracy

 • High sensitivity navigation engine (PVT) tracks as low as
   GPS:-165dBm,GLONASS:- 161dBm

 • 52 track verification channels

 • SBAS (WAAS or EGNOS,MSAS)

 • Active Jammer Remover, removes in-band jammers up to 80 dB-Hz

 • Tracks up to 8 CW jammers

 • Multimode A-GPS (Autonomous, MS-Based, and MS-Assisted) – Need operator support

 • Embedded CGEE / SGEE (With back-end server support) speed up TTFF a lot and makes cold start time to be around 20+ seconds.

 • SiRFGeoRecovTM Reverse EE makes positioning process being done under power saving mode.

 • Reacquisition Time: 0.1 second

 • RF Metal Shield for best performance in noisy environments


Hardware and Software

 • Based on the high performance features of the SiRFstarV™ low power single core logic.

 • Adaptive micropower controller

 • Only 50 to 500μA maintains hot start capability (core logic)

 • < 10mW required for TricklePower™ mode

 • RoHS compliant (lead-free)

 • SMT pads allow fully automatic assembly processes equipment and reflow soldering

 • Advanced navigation features

 • Smart sensor supported by I²C interface

 • External interrupt input for context change detection

 • Dimension : 24x20x2.9mm


Specification

Feature

 Content

 Description

Chipset

 GSD5e/ROM Base

 SiRFstarV low power single chipset

General

 Frequency GPS L1, 1575.42 MHz
 Frequency GLONASS L1,1602~1615MHz
 C/A code 1.023 MHz chip rate
 Channels 52
 Sensitivity GPS -165dB
 Sensitivity GLONASS -161dB

Accuracy

 Position < 2.5 meters
 Velocity 0.01 meters/second
 Time 1 uS synchronized to GPS time

Datum

 Default WGS-84
 Other selectable for other Datum

TTFF (@ -130dBm)

 Reacquisition 0.1 sec., average
 Snap start 1 sec., average
 Hot start 1~2 sec.
 Warm start 9~15 sec.
 Cold start 25~36 sec.

Dynamic Conditions

 Altitude 18,000 meters (60,000 feet) max.
 Velocity 515 meters/second (1000 knots) max.
 Acceleration 4g, max.
 Jerk 20 meters/second3, max.

Power

 Main power input 1.71 ~ 3.6 VDC input
 Power Consumption Average: 60mA (Tracking Mode)
 Backup Power (V_RTC) 1.71 ~ 3.6 VDC battery input

Serial Port

 Electrical interface  
 Protocol messages
 Default UART
 NMEA-0183@9600bps

Environmental Specification

 Operating
 temperature range
 -30 deg. C to +85 deg. C
 Storage temperature range -30 deg. C to +95 deg. C
 Humidity Up to 95% non-condensing or a wet
 Bulb temperature of +35 deg. C




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 Mr. Torres

Tel: 886-2-22281577
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Company Info

Ding Sheng Electronics Ltd. [Taiwan]


Business Type:Manufacturer, Agent
Country/Region: Taiwan

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